Wafer baking technology course

Wafer baking technology course

October 12 - 14, 2027
Wafer & Mixing Innovation Center, Leobendorf, Austria
Technologists, management, research and development
English

Discover the technological foundations of modern wafer production in this practical and engaging training. This course offers a comprehensive overview of the entire flat and hollow wafer manufacturing process - from batter preparation and baking to cream preparation, aeration, refining, spreading, cooling, and cutting.

You will gain valuable insight into the raw materials used in wafer production, including their specifications, properties, and functional roles in achieving consistent product quality. In addition, the training explores the technical fundamentals of wafer production equipment and machinery, helping you better understand process efficiency and performance.

A special highlight of the program is the opportunity to work hands-on in our state-of-the-art lab facilities, where you can apply theoretical knowledge in realistic production scenarios. Along the way, you will connect with industry professionals, raw material specialists, and technical experts, making this training an excellent platform for both learning and networking.

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  • Network with industry professionals, including colleagues from the field, raw material specialists, and technical experts.

  • Gain comprehensive knowledge of the entire flat and hollow wafer production process — from batter preparation and wafer baking to cream preparation, aeration, refining, spreading, cooling, and cutting.

  • Understand the raw materials used in wafer production, including their specifications and functional roles.

  • Explore the technical aspects of wafer production equipment and machinery. 

  • Get hands-on experience in our state-of-the-art lab facilities, applying practical skills in real production scenarios.

Prior knowledge of wafer baking technology is helpful.

  • Three days of hands-on training
  • Digital training materials

  • Networking opportunity over dinner

  • Certificate of participation

  • Lunch, snacks and refreshments

  • Safety shoes can be provided

Get your quotation

Early bird offer: 10% discount until May 31, 2027 – EUR 2,691. Price from June 1, 2027: EUR 2,990.

To enquire for the course, please complete the form. We will then send you a quotation.

Wafer baking technology course

October 12 - 14, 2027

Have a look into our Wafer Innovation Center

How to find us

contact block

Contact us

Consumer Foods Academy


consumerfoods.training@buhlergroup.com

Franz Haas-Straße 1

2100 Leobendorf

Austria